Currently, four companies are in competition vis-à-vis flagship chipsets production, i.e. Qualcomm (Snapdragon), Apple (A-series), Huawei (Kirin) and Samsung (Exynos). The latter three chipsets are used in the respective companies’ flagship smartphones. In this regard, Huawei and Samsung do not get sufficient outside customers to use their chipsets, while Apple does not strictly want to share its SoC with anyone.

The power usage of a chipset is something often talked about. This is an important aspect vis-à-vis battery budget. The helpful thing for that is to fab the chip on lower nanometers. Another good thing is to improve the other important sheet. Moreover, the chipset price is dependent on the size of the same.

This also makes it a clearly tricky thing to explore the right sort of balance between the graphics performance, CPU power as well as other extra features including AI accelerators and image processors.

Therefore, for those people who are curious, Tech Insights has released the annotated photos of these four competitors’ chipset dies. The revelation is that Snapdragon 845 SoC will be 25% smaller than that of Exynos 9810 by Samsung. Moreover, Apple’s A11 Bionic chipset is even smaller as compared to the Snapdragon, which will however not come with the model. Huawei’s Kirin will be somewhere in the middle.

The image scale of these four chipsets is given below.

Moreover, the following table highlights the exact sizes of these chipsets.